What is the technology of Tokusai that enables ultra-fine linear processing?
Why not achieve downsizing with ultra-fine wires with a diameter of 0.01 mm (10 μm)? Corrosion-resistant and durable plating, and even rods, pins, and bars are possible!
This document introduces technology that allows for wire drawing down to φ0.01mm (10μm) and electro-polishing down to φ0.0025mm (2.5μm). It also presents techniques for "plating" and "straightening" these wires. All product manufacturing equipment that maximizes our unique manufacturing know-how is developed in-house. Furthermore, not only technical skills but also the craftsmanship of artisans who carefully pass the wire through the die multiple times to create ultra-fine wires, along with the electro-polishing process and quality inspection, are supported by a skilled group of "Tokusai Masters" who have cultivated their techniques over many years. We can work with difficult-to-process materials such as tungsten and molybdenum, as well as stainless steel, beryllium copper, and nickel-titanium alloys. Additionally, we can manufacture rods, pins, and bars cut from fine wires. It is also possible to perform "plating" along the entire length of the wire. **Features** - Wire drawing processing down to φ0.01mm (10μm), and further processing down to φ0.0025mm (2.5μm) after electro-polishing. - Continuous plating along the entire length of φ0.005mm (5μm) wire is possible due to our unique manufacturing equipment and processing methods. - In "plating," we can respond to short delivery times while reducing processes, labor, and costs.
- Company：トクサイ 本社
- Price：Other
